• TSMC signed a non-binding memorandum of understanding with Sony Semiconductor Solutions to form a strategic partnership to develop next-generation image sensors.
• Companies plan to set up a joint venture, with Sony as majority and controlling shareholder, to establish development and production lines at Sony new fab in Koshi City, Kumamoto.
• Partnership aims to combine Sony sensor design with TSMC process technology and manufacturing to boost image sensor performance.
• Parties are discussing phased JV investment, alongside additional Sony investment at its Nagasaki plant, premised on market demand and Japanese government support.
• Collaboration also targets physical AI applications such as automotive, robotics; JV remains subject to definitive agreements and customary closing conditions.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published the original content used to generate this news brief via EDGAR, the Electronic Data Gathering, Analysis, and Retrieval system operated by the U.S. Securities and Exchange Commission (Ref. ID: 0001046179-26-000215), on May 08, 2026, and is solely responsible for the information contained therein.